Dynamic magnetic stripe communications device with stepped magnetic material for magnetic cards and devices

ABSTRACT

A flexible card may include a dynamic magnetic stripe communications device having multiple layers, such as an electromagnetic generator, a magnet, and a shield. A shield may form a non-flexible layer within the stack and may bend, but the shield may not be able to stretch or compress. Flexible layers may surround and adhere to the shield such that when the card is flexed, the flexible layers may stretch and compress with the movement of the shield. The dynamic magnetic stripe communications device may include one or more coils. Each coil may contain a stepped material, such that a length of a lower layer of the stepped material is longer than a length of a middle layer of the stepped material which is longer than a length of a top layer of the stepped material.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/591,027, titled “DYNAMIC MAGNETIC STRIPE COMMUNICATIONS DEVICE WITHSTEPPED MAGNETIC MATERIAL FOR MAGNETIC CARDS AND DEVICES,” filed on May9, 2017, which is a continuation of U.S. patent application Ser. No.14/660,920, titled “DYNAMIC MAGNETIC STRIPE COMMUNICATIONS DEVICE WITHSTEPPED MAGNETIC MATERIAL FOR MAGNETIC CARDS AND DEVICES,” filed on Mar.17, 2015, which is a continuation of U.S. patent application Ser. No.14/071,565, titled “DYNAMIC MAGNETIC STRIPE COMMUNICATIONS DEVICE WITHSTEPPED MAGNETIC MATERIAL FOR MAGNETIC CARDS AND DEVICES,” filed on Nov.4, 2013, which claims the benefit of U.S. Provisional Patent ApplicationNo. 61/732,080, titled “DYNAMIC MAGNETIC STRIPE COMMUNICATIONS DEVICEWITH STEPPED MAGNETIC MATERIAL FOR MAGNETIC CARDS AND DEVICES,” filedNov. 30, 2012, which is hereby incorporated by reference herein in itsentirety.

BACKGROUND OF THE INVENTION

This invention relates to magnetic cards and devices and associatedpayment systems.

SUMMARY OF THE INVENTION

A card may include a dynamic magnetic stripe communications device. Sucha dynamic magnetic stripe communications device may take the form of amagnetic encoder or an electromagnetic generator. A magnetic encoder maychange the information located on a magnetic medium such that a magneticstripe reader may read changed magnetic information from the magneticmedium. An electromagnetic generator may generate electromagnetic fieldsthat directly communicate data to a magnetic stripe reader. Such anelectromagnetic generator may communicate data serially to a read-headof the magnetic stripe reader.

All, or substantially all, of the front as well as the back of a cardmay be a display (e.g., bi-stable, non bi-stable, LCD, or electrochromicdisplay). Electrodes of a display may be coupled to one or morecapacitive touch sensors such that a display may be provided as atouch-screen display. Any type of touch-screen display may be utilized.Such touch-screen displays may be operable of determining multiplepoints of touch. A barcode, for example, may be displayed across all, orsubstantially all, of a surface of a card. In doing so, computer visionequipment such as barcode readers may be less susceptible to errors inreading a displayed barcode.

A card may include a number of output devices to output dynamicinformation. For example, a card may include one or more RFIDs or ICchips to communicate to one or more RFID readers or IC chip readers,respectively. A card may include devices to receive information. Forexample, an RFID and IC chip may both receive information andcommunicate information to an RFID and IC chip reader, respectively. Acard may include a central processor that communicates data through oneor more output devices simultaneously (e.g., an RFID, IC chip, and adynamic magnetic stripe communications device). The central processormay receive information from one or more input devices simultaneously(e.g., an RFID, IC chip, and a dynamic magnetic stripe communicationsdevice). A processor may be coupled to surface contacts such that theprocessor may perform the processing capabilities of, for example, anEMV chip. The processor may be laminated over and not exposed such thata processor is not exposed on the surface of the card.

A card may be provided with a button in which the activation of thebutton causes a code to be communicated through a dynamic magneticstripe communications device (e.g., the subsequent time a read-headdetector on the card detects a read-head). The code may be indicativeof, for example, a payment option. The code may be received by the cardvia manual input (e.g., onto buttons of the card).

An electromagnetic generator may be constructed as a stacked assembly oflayers where one of the layers includes one or more coils. Inside eachcoil, one or more strips of a material (e.g., a magnetic or non-magneticmaterial) may be provided. Outside of the coil, one or more strips of amaterial (e.g., a magnetic or non-magnetic material) may be provided.For example, three strips of soft magnetic material may be provided in acoil and one strip of hard magnetic material may be stacked exterior ofthe coil on the side of the coil opposite of the side of the coilutilized to serially communicate magnetic stripe data to a magneticstripe reader.

An electromagnetic generator may include a coil that may produce anelectromagnetic field when current is conducted through the coil. Amagnetic material (e.g., a soft-magnetic material) may be located withinthe coil, which may enhance the electromagnetic field produced by thecoil. For example, multiple or several strips of soft-magnetic materialmay be stacked to form a stepped material inside of the coil.

The one or more strips of material (e.g., a soft-magnetic material)within the coil may be of different lengths. Accordingly, for example, alength of a first strip of material may be longer than a length of asecond strip of material, a length of the second strip of material maybe longer than a third strip of material, and so on, to form multiplestrips of material having a stepped structure within the coil.

A magnetic material (e.g., a hard-magnetic material) may be stackedoutside of the coil. The hard-magnetic material may be provided on theside of the coil opposite the side of a coil that communicates to a readhead of a magnetic stripe reader. The electromagnetic field produced bythe coil may be subjected to a torque that may be induced by themagnetic field generated by the hard-magnetic material stacked outsideof the coil.

A shield may be stacked adjacent to the electromagnetic generator. Forexample, a shield may be provided adjacent to the electromagneticgenerator on a side opposite a side that communicates data to aread-head of a magnetic stripe reader. In so doing, the shield mayreduce a magnetic bias from a magnetic material located outside of acoil of an electromagnetic generator, as well as reduce anelectromagnetic field that may be produced by a coil of anelectromagnetic generator. In doing so, magnetic-based signals from anelectromagnetic generator may be substantially attenuated on an adjacentside of the electromagnetic generator.

The shield may, for example, be an assembly of multiple strips ofshielding material that may be bonded together using a flexibleadhesive, such as a room-temperature vulcanizing compound (e.g., an RTVsilicone). The adhesive may, for example, be cured by exposure to achange in one or more conditions (e.g., a change in atmospherichumidity). Once cured, the flexible adhesive may bond the strips ofshielding material together while at the same time remaining flexible.The shield assembly may, for example, be bonded to a magnetic materialusing an adhesive, such as a pressure-sensitive adhesive, that remainsflexible. An additional layer of flexible adhesive may be bonded to theshield assembly. Accordingly, for example, the shield assembly may floatbetween two layers of flexible adhesive to allow the shield assembly tobend and flex while the flexible adhesive stretches and compresses inconformance with movement of the shield assembly.

BRIEF DESCRIPTION OF THE DRAWINGS

The principles and advantages of the present invention can be moreclearly understood from the following detailed description considered inconjunction with the following drawings, in which the same referencenumerals denote the same structural elements throughout, and in which:

FIG. 1 is an illustration of a card and architecture constructed inaccordance with the principles of the present invention;

FIG. 2 is an illustration of a dynamic magnetic stripe communicationsdevice constructed in accordance with the principles of the presentinvention;

FIG. 3 is an illustration of a card constructed in accordance with theprinciples of the present invention;

FIG. 4 is an illustration of a dynamic magnetic stripe communicationsdevice constructed in accordance with the principles of the presentinvention;

FIG. 5 is an illustration of interior portions of a dynamic magneticstripe communications device constructed in accordance with theprinciples of the present invention;

FIG. 6 is an illustration of stacked interior portions of a dynamicmagnetic stripe communications device constructed in accordance with theprinciples of the present invention; and

FIG. 7 is a flow chart of processes constructed in accordance with theprinciples of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows card 100 that may include, for example, a dynamic numberthat may be entirely, or partially, displayed using a display (e.g.,display 106). A dynamic number may include a permanent portion such as,for example, permanent portion 104 and a dynamic portion such as, forexample, dynamic portion 106. Card 100 may include a dynamic numberhaving permanent portion 104 and permanent portion 104 may beincorporated on card 100 so as to be visible to an observer of card 100.For example, labeling techniques, such as printing, embossing, laseretching, etc., may be utilized to visibly implement permanent portion104.

Card 100 may include a second dynamic number that may also be entirely,or partially, displayed via a second display (e.g., display 108).Display 108 may be utilized, for example, to display a dynamic code suchas a dynamic security code. Card 100 may also include third display 122that may be used to display graphical information, such as logos andbarcodes. Third display 122 may also be utilized to display multiplerows and/or columns of textual and/or graphical information.

Persons skilled in the art will appreciate that any one or more ofdisplays 106, 108, and/or 122 may be implemented as a bi-stable display.For example, information provided on displays 106, 108, and/or 122 maybe stable in at least two different states (e.g., a powered-on state anda powered-off state). Any one or more of displays 106, 108, and/or 122may be implemented as a non-bi-stable display. For example, the displayis stable in response to operational power that is applied to thenon-bi-stable display. Other display types, such as LCD orelectrochromic, may be provided as well.

Other permanent information, such as permanent information 120, may beincluded within card 100, which may include user specific information,such as the cardholder's name or username. Permanent information 120may, for example, include information that is specific to card 100(e.g., a card issue date and/or a card expiration date). Information 120may represent, for example, information that includes information thatis both specific to the cardholder, as well as information that isspecific to card 100.

Card 100 may accept user input data via any one or more data inputdevices, such as buttons 110-118. Buttons 110-118 may be included toaccept data entry through mechanical distortion, contact, or proximity.Buttons 110-118 may be responsive to, for example, induced changesand/or deviations in light intensity, pressure magnitude, or electricand/or magnetic field strength. Such information exchange may bedetermined and processed by a processor of card 100 as data input.

Dynamic magnetic stripe communications device 102 may be included oncard 100 to communicate information to, for example, a read-head of amagnetic stripe reader via, for example, electromagnetic signals.Dynamic magnetic stripe communications device 102 may be formed on aprinted circuit board (PCB) as a stacked structure including, forexample, an electromagnetic generator including an interior steppedmaterial (e.g., stepped soft-magnetic material 124), an exterior magnet,and a shield. The electromagnetic generator, exterior magnet and shieldmay be stacked and adhered together using any combination of flexibleadhesion components to form dynamic magnetic stripe communicationsdevice 102 having elastic and flexible characteristics.

Accordingly, for example, dynamic magnetic stripe communications device102 may exhibit a flexibility whereby each layer of the stack may moveindependently of each other layer, while at the same time maintainingadhesion between all layers of the stack. In so doing, individualcomponents of each layer of dynamic magnetic stripe communicationsdevice 102 may maintain a correct orientation to each other layer whilecard 100 may undergo bending and flexing.

A material (e.g., stepped soft-magnetic material 124) and an exteriormagnet (not shown) may, for example, interact to improve performance ofdynamic magnetic stripe communications device 102 while dynamic magneticstripe communications device 102 generates an electromagnetic signal.For example, stepped ends of soft-magnetic material 124 may cause agradual change (e.g., a gradual increase in the magnetic fieldmagnitude) as a function of a position of a read head of a magneticstripe reader along dynamic magnetic stripe communications device 102(e.g., along end portions of dynamic magnetic stripe communicationsdevice 102).

Card 100 may, for example, be formed as a laminate structure of two ormore layers. Card 100 may, for example, include top and bottom layers ofa plastic material (e.g., a polymer). Electronics package circuitry(e.g., one or more printed circuit boards, a dynamic magnetic stripecommunications device, a battery, a display, a processor, and buttons)may be sandwiched between top and bottom layers of a laminate structureof card 100. A material (e.g., a polyurethane-based or silicon-basedsubstance) may be applied between top and bottom layers and cured (e.g.,solidified) to form card 100 that has a flexible laminate structure.

FIG. 1 shows architecture 150, which may include, for example, one ormore processors 154. One or more processors 154 may be configured toutilize external memory 152, internal memory within processor 154, or acombination of external memory 152 and internal memory for dynamicallystoring information, such as executable machine language, relateddynamic machine data, and user input data values.

One or more of the components shown in architecture 150 may beconfigured to transmit information to processor 154 and/or may beconfigured to receive information as transmitted by processor 154. Forexample, one or more displays 156 may be coupled to receive data fromprocessor 154. The data received from processor 154 may include, forexample, at least a portion of dynamic numbers and/or dynamic codes. Thedata to be displayed on the display may be displayed on one or moredisplays 156.

One or more displays 156 may, for example, be touch sensitive and/orproximity sensitive. For example, objects such as fingers, pointingdevices, etc., may be brought into contact with displays 156, or inproximity to displays 156. Detection of object proximity or objectcontact with displays 156 may be effective to perform any type offunction (e.g., transmit data to processor 154). Displays 156 may havemultiple locations that are able to be determined as being touched, ordetermined as being in proximity to an object.

Input and/or output devices may be implemented within architecture 150.For example, integrated circuit (IC) chip 160 (e.g., an EMV chip) may beincluded within architecture 150, that can communicate information witha chip reader (e.g., an EMV chip reader). Radio frequency identification(RFID) module 162 may be included within architecture 150 to enable theexchange of information with an RFID reader.

Other input and/or output devices 168 may be included withinarchitecture 150, for example, to provide any number of input and/oroutput capabilities. For example, other input and/or output devices 168may include an audio device capable of receiving and/or transmittingaudible information. Other input and/or output devices 168 may include adevice that exchanges analog and/or digital data using a visible datacarrier. Other input and/or output devices 168 may include a device, forexample, that is sensitive to a non-visible data carrier, such as aninfrared data carrier or electromagnetic data carrier.

Electromagnetic field generators 170-174 may communicate one or moretracks of electromagnetic data to read-heads of a magnetic stripereader. Electromagnetic field generators 170-174 may include, forexample, a series of electromagnetic elements, where eachelectromagnetic element may be implemented as a coil wrapped around oneor more materials (e.g., a soft-magnetic material and/or a non-magneticmaterial). Additional materials, such as a magnet (not shown) and ashield (not shown), may be stacked in proximity to electromagnetic fieldgenerators 170-174 using any combination of adhesives (e.g., flexibleadhesives), so that the stacked components may be flexed while remainingwithin a substantially fixed relationship to one another.

Electrical excitation by processor 154 of one or more coils of one ormore electromagnetic elements via, for example, driving circuitry 164may be effective to generate electromagnetic fields from one or moreelectromagnetic elements. One or more electromagnetic field generators170-174 may be utilized to communicate electromagnetic information to,for example, one or more read-heads of a magnetic stripe reader.

Timing aspects of information exchange between architecture 150 and thevarious I/O devices implemented on architecture 150 may be determined byprocessor 154. One or more detectors 166 may be utilized, for example,to sense the proximity, mechanical distortion, or actual contact, of anexternal device, which in turn, may trigger the initiation of acommunication sequence. The sensed presence or touch of the externaldevice may then be communicated to a controller (e.g., processor 154),which in turn may direct the exchange of information betweenarchitecture 150 and the external device. The sensed presence,mechanical distortion, or touch of the external device may be effectiveto, for example, determine the type of device or object detected.

The detection may include, for example, the detection of a read-headhousing of a magnetic stripe reader. In response, processor 154 mayactivate one or more electromagnetic field generators 170-174 toinitiate a communications sequence with, for example, one or moreread-heads of a magnetic stripe reader. The timing relationshipsassociated with communications to one or more electromagnetic fieldgenerators 170-174 and one or more read-heads of a magnetic stripereader may be provided through use of the detection of the magneticstripe reader.

Persons skilled in the art will appreciate that processor 154 mayprovide user-specific and/or card-specific information throughutilization of any one or more of buttons 110-118, RFID 162, IC chip160, electromagnetic field generators 170-174, and other input and/oroutput devices 168.

Persons skilled in the art will appreciate that a card (e.g., card 100of FIG. 1) may, for example, be a self-contained device that derives itsown operational power from one or more batteries 158. Furthermore, oneor more batteries 158 may be included, for example, to provideoperational power to a card for a number of years (e.g., approximately2-4 years). One or more batteries 158 may be included, for example, asrechargeable batteries.

FIG. 2 shows dynamic magnetic stripe communications device 200 that mayinclude printed circuit board (PCB) 202 and an adhesive layer (notshown) on top of PCB 202, electromagnetic generator 210 and anotheradhesive layer (not shown) on top of electromagnetic generator 210,magnet 215, adhesive layer 216, shield 220, and protective layer 230.Electromagnetic generator 210 may include, for example, one or morecoils (e.g., two coils 211 and 213) that may each include a conductivewinding (e.g., a copper winding) that may surround material (e.g.,stepped soft-magnetic material 214 and 212, respectively) along at leasta portion of respective lengths of materials 212 and 214. Two tracks ofelectromagnetic data may, for example, be communicated byelectromagnetic generator 210 to read-heads of a magnetic stripe readerby appropriate control of current conducted by coils 211 and 213.Materials 212 and 214 may, for example, include one or more (e.g.,three) layers of material (e.g., soft-magnetic material) each having adifferent length to provide a stepped shape on one or both ends ofmaterials 212 and 214.

Electromagnetic generator 210 may, for example, be constructed as amultiple-layer circuit (e.g., a circuit constructed on a multiple-layerprinted circuit board (PCB)). A first layer, for example, may includepatterns of a conductive element (e.g., copper) that may be added to aPCB substrate according to a patterning mask definition layer to formportions (e.g., the bottom portions) of coils 211 and 213. Alternately,a first layer of a PCB may, for example, include patterns of aconductive element (e.g., copper) that may be subtracted from apre-plated PCB substrate according to an etching mask definition layerto form portions (e.g., the bottom portions) of coils 211 and 213. Asecond PCB layer may, for example, use additive and/or subtractivetechniques to form portions (e.g., the top portions) of coils 211 and213.

The first and second PCB layers may be separated by an insulation layer(e.g., a dielectric layer). Pockets within the insulation layer (e.g.,pockets located between the top and bottom portions of coils 211 and213) may include a magnetic material (e.g., a lamination stepped layersof soft magnetic material) to form materials 212 and 214.

The top and bottom portions of coils 211 and 213 may be interconnectedthrough the insulation layer (e.g., interconnected using plated viasthrough the insulation layer) to form coils 211 and 213. Conductive pads(not shown) may be patterned at each end of coils 211 and 213 on thefirst and/or second layers of the PCB, so that electrical signals (e.g.,current) may be conducted through coils 211 and 213.

Magnet 215 may be arranged in proximity to coils 211 and 213, such thatmagnet 215 may extend along at least a portion of a length of coils 211and 213. Magnet 215 may be arranged in proximity to coils 211 and 213,such that magnet 215 may extend along at least a portion of a width ofcoils 211 and 213.

Layer 216 may include a flexible adhesive, such as a pressure-sensitiveadhesive (e.g., a solvent-based acrylic). Layer 216 may include a liner(not shown) that may remain in place to allow compression of layer 216onto magnet 215. Accordingly, for example, adhesion between layer 216and layer 215 may be activated by a die of a press (not shown) while theliner (not shown) of layer 216 prevents adhesion of layer 216 to thedie.

Shield 220 may include, for example, two shields (e.g., shields 221 and223) that may be bonded together (e.g., via layer 222) and placed inproximity to magnet 215. Shields 221 and 223 may include, for example,soft-magnetic materials. One or both sides of shields 221 and 223 may beabraded to improve, for example, an adhesion quality to layer 222 and/oran adhesion quality to layers 216 and/or 231.

Layer 222 may, for example, include a flexible adhesive, such as aroom-temperature vulcanizing material (e.g., an RTV silicone). Layer 222may, for example, cure when exposed to a change in one or more externalconditions (e.g., atmospheric humidity). Once cured, layer 222 may forma bond between shields 221 and 223 that remains flexible. Accordingly,for example, layer 222 may allow shields 221 and 223 to be flexed, bent,or otherwise manipulated, while maintaining the bond between layers 221and 223.

Shield 220 may, for example, be placed in proximity to and bonded withmagnet 215 using a flexible adhesive layer, such as a pressure-sensitiveadhesive layer (e.g., solvent-based acrylic layer 216) or otheradhesive. Adhesive layer 216 may form a flexible bond between shield 220and magnet 215, such that shield 220 maintains a substantially fixedrelationship with relation to magnet 215 despite any flexing, bending,or any other form of manipulation that may occur with dynamic magneticstripe communications device 200.

Shield 220 may be attached to electromagnetic generator 210 via magnet215 and any intervening adhesion layers (e.g., layers 222 and 216) toform an electronic package that may be held together with otherelectronic packages via a mold while a liquid laminate material (e.g., apolyurethane-based or silicon-based substance) is provided (e.g.,sprayed) into the mold. A protective layer, such as a tape layer (e.g.,polyimide tape layer 230) may wrap around at least portions of shield220, magnet 215, electromagnetic generator 210, PCB 202 and/orintervening adhesion layers to prevent liquid laminate from penetratingthe individual layers of dynamic magnetic stripe communications device200. The liquid laminate material may be cured (e.g., solidified) via areaction caused by a change in condition (e.g., chemical, temperature,or UV light). The resulting interior laminate may be sandwiched betweentwo layers of polymer to form a card having a laminate structure withtop, middle, and bottom layers.

Layer 230 may include a protective layer, such as a tape layer (e.g.,polyimide tape layer 232) and an adhesive layer, such as a flexible,pressure-sensitive adhesive layer (e.g., solvent-based acrylic layer231). Accordingly, shield 220 may float between flexible adhesive layers231 and 216 to allow shield 220 to remain in a substantially fixedrelationship with respect to magnet 215 and electromagnetic generator210 notwithstanding any flexing, bending or any other type ofmanipulation of dynamic magnetic stripe communications device 200.

FIG. 3 shows card 300. Card 300 may include one or more printed circuitboards (e.g., boards 308, 310, and 312). Boards 308, 310, and/or 312,may contain, for example, a processor, a battery, a display, a button,and any other component that may be provided on a card. Card 300 mayinclude region 314 that may include a dynamic magnetic stripecommunications device (not shown) and stepped materials (e.g.,soft-magnetic materials 304 and 306) displaced within coils of thedynamic magnetic strip communications device (not shown). Steppedmaterial 304 may, for example, be displaced within a coil of a dynamicmagnetic stripe communications device (not shown) that may communicate afirst track of magnetic stripe data to a read head of a magnetic stripereader. Stepped material 306 may, for example, be displaced within acoil of a dynamic magnetic stripe communications device (not shown) thatmay communicate a second track of magnetic stripe data to a read head ofa magnetic stripe reader.

Positioning of stepped material 304 within region 314 may beestablished, for example, by centering stepped material 304 about acenterline of a magnetic stripe data track (e.g., Track 1) position oncard 300. Positioning of stepped material 306 within region 314 may beestablished, for example, by centering stepped material 306 about acenterline of a magnetic stripe data track (e.g., Track 2) position oncard 300. Persons skilled in the art will appreciate that an additionalstepped material may, for example, be positioned about a centerline of amagnetic stripe data track (e.g., Track 3) position on card 300 toestablish three tracks of data communication capability from card 300.

Stepped materials 304 and 306 may include two or more layers (e.g.,three layers) of material (e.g., soft magnetic material). A first layerof material of stepped materials 304 and/or 306 may have a length 316that is between approximately 2.9 and 3.1 inches (e.g., approximately2.984 inches). A second layer of material of stepped materials 304and/or 306 may have a length 318 that is between approximately 2.8 and2.9 inches (e.g., approximately 2.858 inches). A third layer of materialof stepped materials 304 and/or 306 may have a length 320 that isbetween approximately 2.7 and 2.8 inches (e.g., approximately 2.734inches).

Stepped materials 304 and 306 may include shorter layers stacked on topof longer layers so as to form a stepped structure on one or both endsof stepped materials 304 and 306. For example, a bottom layer of steppedmaterials 304 and 306 may extend beyond a length of a middle layer ofstepped materials 304 and 306 by a length 322 that is betweenapproximately 0.06 and 0.065 inches (e.g., approximately 0.0625 inches).Additionally, for example, the middle layer of stepped materials 304 and306 may extend beyond a length of a top layer of stepped materials 304and 306 by a length 324 that is between approximately 0.06 and 0.065inches (e.g., approximately 0.0625 inches).

Card 300 may be laminated to form a card assembly, such that thelaminate may cover a dynamic magnetic stripe communications deviceincluding stepped materials 304 and 306, PCBs 308-312 and any othercomponents that may exist on PCBs 308-312. Prior to lamination, forexample, a dynamic magnetic stripe communications device includingstepped materials 304 and 306 may be built up onto PCB 312 via one ormore production steps to yield an assembly that extends away from PCB312 in a stacked fashion.

FIG. 4 shows a cross-section of dynamic magnetic stripe communicationsdevice 400. A strip of adhesive (e.g., cyanoacrylate 404) or otheradhesive may be applied (e.g., manually or robotically) to PCB 402.Electromagnetic generator 406 may be placed onto PCB 402 along the stripof adhesive 404. Electromagnetic generator 406 may include a coilwrapped around a stepped material (e.g., soft-magnetic material 412) andmay include another coil wrapped around a stepped material (e.g.,soft-magnetic material 414).

PCB 402 may be placed into a press and PCB 402, adhesive layer 404, andelectromagnetic generator 406 may be pressed together for a period oftime (e.g., 30 seconds) thereby activating adhesive 404 to form aflexible bond between electromagnetic generator 406 and PCB 402. Oncecompressed, a stacked height of the combination of PCB 402, adhesivelayer 404, and electromagnetic generator 406 may be betweenapproximately 0.0095 and 0.0105 inches (e.g., approximately 0.010inches).

A strip of adhesive (e.g., cyanoacrylate 410) or other adhesive may beapplied (e.g., manually or robotically) to electromagnetic generator406. Magnet 420 may be placed onto electromagnetic generator 406 alongthe strip of adhesive 410. The stack may be placed into a press and PCB402, adhesive layer 404, electromagnetic generator 406, adhesive layer410, and magnet 420 may be pressed together for a period of time (e.g.,30 seconds) thereby activating adhesive 410 to form a flexible bondbetween magnet 420 and electromagnetic generator 406. Once compressed, astacked height of the combination of PCB 402, adhesive layer 404,electromagnetic generator 406, adhesive layer 410, and magnet 420 may bebetween approximately 0.0145 and 0.0175 inches (e.g., 0.016 inches).

An adhesive, such as a pressure-activated adhesive (e.g., solvent-basedacrylic 408) may be applied to the stacked combination of PCB 402,adhesive layers 404 and 410, electromagnetic generator 406, and magnet420. The stacked combination may then be pressed for a period of time(e.g., 30 seconds) to form a flexible bond between a top surface ofmagnet 420 and a bottom surface of adhesive layer 408. A top surface ofadhesive layer 408 may be lined so as to avoid adhering adhesive layer408 to the press. In addition, a die of the press may be shaped toconform to the shape of magnet 420. Accordingly, for example, adhesivelayer 408 may be compressed to wrap around the edges of magnet 420 andalong a length of each end of electromagnetic generator 406. Adhesivelayer 408 may, for example, be non-conductive.

A liner (not shown) attached to adhesive layer 408 may be peeled away toexpose a top surface of adhesive layer 408. Shield 416 may be placedonto the exposed adhesive layer 408. A protective layer, such as aprotective tape layer (e.g., polyimide tape layer 418) may be placedonto shield 416 and wrapped around the stacked structure substantiallyas shown. Protective layer 418 may include a layer of adhesive, such asa pressure-activated adhesive (e.g., a solvent-based acrylic).Accordingly, for example, protective layer 418 may be pressed ontoshield 416 to activate the adhesive layer. Shield 416 may, for example,float between the layer of adhesive of protective layer 418 and adhesivelayer 408.

Accordingly, for example, shield 416 may be substantially free to movebetween top and bottom layers of adhesive during any bending, flexing,or manipulation of dynamic magnetic stripe communications device 400while remaining substantially fixed in position relative to magnet 420and electromagnetic generator 406. Once compressed, a stacked height ofthe combination of PCB 402, adhesive layer 404, electromagneticgenerator 406, adhesive layer 410, magnet 420, adhesive layer 408,shield 416, and protective layer 418 may be between approximately 0.0165and 0.0215 inches (e.g., approximately 0.019 inches).

FIG. 5 shows material portions that may exist within one or more coilsof a dynamic magnetic stripe communications device. As per an example, astepped material (e.g., soft-magnetic material layers 502, 504 and 506)may exist within a first coil of a dynamic magnetic stripecommunications device to enhance communication of a first track ofmagnetic stripe information to a read head of a magnetic stripe readerfrom the dynamic magnetic stripe communications device. A length 508 oflayer 502 may be longer than a length 510 of layer 504, which may inturn be longer than a length 512 of layer 506 to form a steppedstructure having width 516 that may be between approximately 0.14 and0.145 inches (e.g., 0.142 inches).

As per another example, a stepped material (e.g., soft-magnetic materiallayers 514, 516 and 518) may exist within a second coil of a dynamicmagnetic stripe communications device to enhance communication of asecond track of magnetic stripe information to a read head of a magneticstripe reader from the dynamic magnetic stripe communications device. Alength 524 of layer 514 may be longer than a length 522 of layer 516,which may in turn be longer than a length 520 of layer 518 to form astepped structure having width 526 that may be between approximately0.14 and 0.145 inches (e.g., 0.142 inches).

FIG. 6 shows a layered configuration that may include layered materials(e.g., soft-magnetic material stack 602-606 and soft-magnetic materialstack 608-612). Three layers of material (e.g., soft-magnetic materialstack 602-606) may, for example, be combined to form the steppedmaterial contained within a first coil of a dynamic magnetic stripecommunications device that may communicate a first track of magneticstripe information to a read head of a magnetic stripe reader. Threelayers of material (e.g., soft-magnetic material stack 608-612) may, forexample, be combined to form the stepped material contained within asecond coil of a dynamic magnetic stripe communications device that maycommunicate a second track of magnetic stripe information to a read headof a magnetic stripe reader. Persons skilled in the art will appreciatethat any number of layers (e.g., 2 or more layers) of stepped material(e.g., soft-magnetic material) may be used to form stepped materialincluded within one or more coils of a dynamic magnetic stripecommunications device.

Layer 604 may be positioned to be approximately centered within a lengthof layer 606 while layer 602 may be positioned to be approximatelycentered within a length of layer 604. Accordingly, the stacked assemblymay have stepped ends. Similarly, layer 610 may be positioned to beapproximately centered within a length of layer 612 while layer 608 maybe positioned to be approximately centered within a length of layer 610to form a stacked assembly having stepped ends.

FIG. 7 shows flow charts 710 through 740. Sequence 710 may include, forexample, applying an adhesive, such as a flexible adhesive, between anelectromagnetic generator and a PCB and activating the flexible adhesive(e.g., as in step 711) by pressing the electromagnetic generator ontothe PCB. In step 712, an adhesive, such as a flexible adhesive, may beapplied between a magnet and the electromagnetic generator and activatedby pressing the magnet onto the electromagnetic generator. In step 713,an adhesive, such as a pressure-sensitive adhesive (e.g., asolvent-based acrylic) may be applied between a shield and the magnetand activated by pressing the shield onto the magnet. In step 714, aprotective layer containing a flexible adhesive, such as apressure-sensitive adhesive (e.g., a solvent-based acrylic) may bewrapped around the shield to allow the shield to float between theflexible adhesive of the protective layer and the flexible adhesivelayer between the shield and the magnet.

In step 721 of sequence 720, a flexible electromagnetic generator may beinstalled (e.g., glued) onto a flexible PCB of a flexible card using aflexible glue. In step 722, a flexible magnet may be installed (e.g.,glued) onto the flexible electromagnetic generator using a flexibleglue. In step 723, a substantially non-flexible shield may be installed(e.g., glued) onto the magnet using a flexible glue. In step 724, theshield may be adhered to and cushioned between two layers of flexibleglue, such that when the shield is bent or flexed, the two layers offlexible glue may stretch, compress or otherwise conform to the flexedor bent shield (e.g., as in step 725). Accordingly, for example, theshield may remain laminated to the magnet while the card is beingflexed, bent, or otherwise manipulated.

In step 731 of sequence 730, layers of a dynamic magnetic stripecommunications device may be stacked onto a card. One of the layers maybe non-flexible (e.g., a shield) and may be sandwiched between twoflexible layers (e.g., two layers of flexible adhesive as in step 732).As the card is bent, flexed, or manipulated, the non-flexible layer maynot stretch or compress, but the flexible layers that are adhered to thenon-flexible layer may stretch or compress. Accordingly, for example,while the non-flexible layer is bent, flexed or otherwise manipulated,the non-flexible layer moves within the flexible layers (e.g., as instep 733) such that the flexible adhesive of the flexible layers adheresto the non-flexible layer and stretches and compresses to conform to themovement of the non-flexible layer.

In step 741 of sequence 740, layers of a dynamic magnetic stripecommunications device may be stacked onto a card. One of the layers mayinclude one or more coils of the dynamic magnetic stripe communicationsdevice. Each coil may include one or more layers of material (e.g., asoft-magnetic material) contained within each coil. Each layer ofmaterial within each coil of the dynamic magnetic stripe communicationsdevice may be shorter than the layer beneath it (e.g., as in step 742).For example, a length of a bottom layer of material may be made to belonger as compared to a length of a middle layer of material, while alength of the middle layer of material may be made to be longer ascompared to a length of a top layer of material.

Persons skilled in the art will appreciate that the present invention isnot limited to only the embodiments described. Instead, the presentinvention more generally involves dynamic information. Persons skilledin the art will also appreciate that the apparatus of the presentinvention may be implemented in ways other than those described herein.All such modifications are within the scope of the present invention,which is limited only by the claims that follow.

What is claimed is:
 1. A method comprising: forming a first strip ofmagnetic material; forming a second strip of magnetic material on thefirst strip, a length of the second strip less than the length of thefirst strip; and forming a conductive winding, at least a portion of thefirst strip and the second strip within the conductive winding.
 2. Themethod of claim 1, further comprising: forming a third strip of magneticmaterial on the second strip, a length of the third strip less than thelength of the first strip.
 3. The method of claim 1, further comprising:forming a third strip of magnetic material on the second strip, a lengthof the third strip less than the length of the second strip.
 4. Themethod of claim 1, wherein the forming a conductive winding includesconstructing the conductive winding as a multiple layer circuit.
 5. Themethod of claim 1, wherein the forming a conductive winding includesforming the conductive winding as a circuit on a plurality of layers ofa multiple layer circuit board.
 6. The method of claim 1, wherein theforming a conductive winding includes forming patterns of a conductiveelement added to a printed circuit board substrate using a patterningmask definition layer to form a portion of the conductive winding. 7.The method of claim 1, wherein the forming a conductive winding includesforming patterns of a conductive element subtracted from a pre-platedprinted circuit board substrate using an etching mask definition layerto form a portion of the conductive winding.
 8. The method of claim 1,wherein the forming a conductive winding includes forming patterns of afirst conductive element added to a printed circuit board substrateusing a first patterning mask definition layer to form a first portionof the conductive winding, and forming patterns of a second conductiveelement added to a printed circuit board substrate using a secondpatterning mask definition layer to form a second portion of theconductive winding.
 9. The method of claim 1, wherein the forming aconductive winding includes forming a first layer of a multiple-layercircuit to include patterns of a first conductive element using a firstmask definition layer, the first conductive element being a firstportion of the conductive winding, and forming a second layer of themultiple-layer circuit to include patterns of a second conductiveelement using a second mask definition layer, the second conductiveelement being a second portion of the conductive winding.
 10. The methodof claim 1, further comprising: forming an insulation layer with aplurality of pockets, wherein the forming a conductive winding includesforming a first layer of a multiple-layer printed circuit board toinclude patterns of a first conductive element using a first maskdefinition layer, the first conductive element being a first portion ofthe conductive winding, and forming a second layer of the multiple-layerprinted circuit board to include patterns of a second conductive elementusing a second mask definition layer, the second conductive elementbeing a second portion of the conductive winding, and the forming aninsulation layer includes forming the insulation layer to separate thefirst layer and the second layer, and the forming a first strip includesforming the first strip in at least one of the plurality of pockets. 11.The method of claim 1, further comprising: installing a magnet onto theconductive winding.
 12. The method of claim 1, further comprising:installing a non-flexible shield on the conductive winding.
 13. Themethod of claim 1, further comprising: installing a non-flexible shieldon the conductive winding and between two layers of flexible adhesive.14. The method of claim 1, further comprising: installing a magnet ontothe conductive winding; installing a non-flexible shield on theconductive winding.
 15. The method of claim 1, further comprising:installing a magnet onto the conductive winding; installing anon-flexible shield between two layers of flexible adhesive on theconductive winding.
 16. The method of claim 1, further comprising:installing a magnet onto the conductive winding, wherein the forming aconductive winding includes forming the conductive winding as a circuiton a plurality of layers of a multiple layer circuit board.
 17. Themethod of claim 1, further comprising: installing a non-flexible shieldon the conductive winding, wherein the forming a conductive windingincludes forming the conductive winding as a circuit on a plurality oflayers of a multiple layer circuit board.
 18. The method of claim 1,further comprising: installing a magnet onto the conductive winding; andinstalling a non-flexible shield on the conductive winding, wherein theforming a conductive winding includes forming the conductive winding asa circuit on a plurality of layers of a multiple layer circuit board.19. The method of claim 1, further comprising: installing a magnet ontothe conductive winding; and installing a non-flexible shield on theconductive winding, wherein the forming a conductive winding includesforming patterns of a first conductive element added to a printedcircuit board substrate using a first patterning mask definition layerto form a first portion of the conductive winding, and forming patternsof a second conductive element added to a printed circuit boardsubstrate using a second patterning mask definition layer to form asecond portion of the conductive winding.
 20. The method of claim 1,further comprising: installing a magnet onto the conductive winding;installing a non-flexible shield on the conductive winding; and formingan insulation layer with a plurality of pockets, wherein the forming aconductive winding includes forming a first layer of a multiple-layerprinted circuit board to include patterns of a first conductive elementusing a first mask definition layer, the first conductive element beinga first portion of the conductive winding, and forming a second layer ofthe multiple-layer printed circuit board to include patterns of a secondconductive element using a second mask definition layer, the secondconductive element being a second portion of the conductive winding, andthe forming an insulation layer includes forming the insulation layer toseparate the first layer and the second layer, and the forming a firststrip includes forming the first strip in at least one of the pluralityof pockets.